Aluminum Sputtering Target
Al
7429-90-5
7429-90-5
| Product | Product Code |
Order or Specifications |
99% Aluminum Sputtering Target |
AL-M-02-ST |
 |
99.5% Aluminum Sputtering Target |
AL-M-025-ST |
|
99.9% Aluminum Sputtering Target |
AL-M-03-ST |
|
99.95% Aluminum Sputtering Target |
AL-M-035-ST |
|
99.99% Aluminum Sputtering Target |
AL-M-04-ST |
|
99.999% Aluminum Sputtering Target |
AL-M-05-ST
|
|
See research below. American Elements specializes in producing high purity Aluminum sputtering targets with the highest possible density 
and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard Sputtering Targets for thin film are available monoblock or bonded with dimensions and configurations up to 820 mm with hole drill locations and threading, beveling, grooves and backing designed to work with both older sputtering devises as well as the latest process equipment, such as large area coating for solar energy or fuel cells and flip-chip applications. Research sized targets are also produced as well as custom sizes and alloys. All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Induction Plasma Spectrometry (ICP). "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval target. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as other machined shapes and through other processes nanoparticles. We also produce Aluminum as disc, granules, ingot, pellets, pieces, powder, and rod. Other shapes are available by request.
and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard Sputtering Targets for thin film are available monoblock or bonded with dimensions and configurations up to 820 mm with hole drill locations and threading, beveling, grooves and backing designed to work with both older sputtering devises as well as the latest process equipment, such as large area coating for solar energy or fuel cells and flip-chip applications. Research sized targets are also produced as well as custom sizes and alloys. All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Induction Plasma Spectrometry (ICP). "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval target. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as other machined shapes and through other processes nanoparticles. We also produce Aluminum as disc, granules, ingot, pellets, pieces, powder, and rod. Other shapes are available by request.
Aluminum is a Block P, Group 13, Period 3 element. The electronic configuration is [Ne] 3s2 3p1. In its elemental form aluminum's CAS number is 7429-90-5. The aluminum atom has a radius of 143.2.pm and it's Van der Waals radius is 200.pm.
| Formula | CAS No. | Appearance | Molecular Weight | Density | Melting Point | Boiling Point |
| Al | 7429-90-5 | Silvery | 26.98 | 2700 kg/m³ | 660.32 °C | 2519 °C |
| PRODUCT CATALOG | Submicron & Nanopowder | Tolling | Ultra High Purity | Sputtering Target | Crystal Growth | Rod, Plate, Powder, etc. |
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