Gold-Silicon Sputtering Target
Au/Si
7440-57-5/7440-21-3
7440-57-5/7440-21-3
| Product | Product Code |
Order or Specifications |
99% Gold-Silicon Sputtering Target |
AU-SI-02-ST |
 |
99.5% Gold-Silicon Sputtering Target |
AU-SI-025-ST |
|
99.9% Gold-Silicon Sputtering Target |
AU-SI-03-ST |
|
99.95% Gold-Silicon Sputtering Target |
AU-SI-035-ST |
|
99.99% Gold-Silicon Sputtering Target |
AU-SI-04-ST |
|
99.999% Gold-Silicon Sputtering Target |
AU-SI-05-ST
|
|
See research below. American Elements specializes in producing high purity Gold-Silicon sputtering targets with the highest possible density 
and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard target sizes range from 1" to 8" in diameter and from 2mm to 1/2" thick. "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval target. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as other machined shapes and through other processes nanoparticles. We also produce Gold as disc, granules, ingot, pellets, pieces, powder, and rod. Other shapes are available by request.
and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard target sizes range from 1" to 8" in diameter and from 2mm to 1/2" thick. "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval target. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as other machined shapes and through other processes nanoparticles. We also produce Gold as disc, granules, ingot, pellets, pieces, powder, and rod. Other shapes are available by request. Gold is a Block D, Group 11, Period 6 element. The electronic configuration is [Xe] 4f142 5d10 6s1. In its elemental form gold's CAS number is 7440-57-5. The gold atom has a radius of 144.2.pm and it's Van der Waals radius is 166.pm.
Silicon is a Block P, Group 14, Period 3 element. The electronic configuration is [Ne] 3s2 3p2. In its elemental form silicon's CAS number is 7440-21-3. The silicon atom has a radius of 117.6.pm and it's Van der Waals radius is 210.pm.
| Formula | CAS No. | Appearance | Molecular Weight |
| Au/Si | 7440-57-5/7440-21-3 | Metal |
| PRODUCT CATALOG | Submicron & Nanopowder | Tolling | Ultra High Purity | Sputtering Target | Crystal Growth | Rod, Plate, Powder, etc. |
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This website and all pages, designs, concepts, logos, and color schemes herein are
the copyrighted proprietary rights and intellectual property of American Elements.
