American Elements
Copper Foil
Cu
7440-50-8
Product
Product Code
Order or Specifications
99% Copper Foil
CU-M-02F
 Contact American Elements
99.5% Copper Foil
CU-M-025F
 Contact American Elements
99.9% Copper Foil
CU-M-03F
 Contact American Elements
99.95% Copper Foil
CU-M-035F
 Contact American Elements
99.99% Copper Foil
CU-M-04F
 Contact American Elements
99.999% Copper Foil
CU-M-05F
 Contact American Elements
See research below. American Elements specializes in producing Copper as rolled foils and sheets in various thicknesses and sizes. Most foils are produced from cast ingots for use in coating and thin film Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Organometallic and Chemical Vapor Deposition (MOCVD) for specific applications such as fuel cells and solar energy. Thickness can range from 0.003" to approximately 2mm for all metals. Some metals can also be rolled down as thin as 0.001". Piece sizes are available up to approximately 7" maximum width. Maximum lengths of about 20" can be obtained with a nominal thickness between about 0.005" and 0.020". Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as other machined shapes and through other processes nanoparticles. We also produce Copper as rods, powder and plates. Other shapes are available by request.

Copper is a Block D, Group 11, Period 4 element. The electronic configuration is [Ar] 3d10 4s1. In its elemental form copper's CAS number is 7440-50-8. The copper atom has a radius of 127.8 .pm and it's Van der Waals radius is 140.pm.

Formula CAS No. Appearance Molecular Weight
Cu 7440-50-8 Reddish Metal 63.55
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Copper Foil Recent Research

  • Structure and giant magnetoresistance behaviour of Co-Cu/Cu multilayers electrodeposited under various deposition conditions.
    J Nanosci Nanotechnol. 2006 Jul;6(7):2000-12.

  • Performance of the Nzi and other traps for biting flies in North America.
    Bull Entomol Res. 2006 Aug;96(4):387-97.

  • Copper hydroxide nanoneedle and nanotube arrays fabricated by anodization of copper.
    J Phys Chem B Condens Matter Mater Surf Interfaces Biophys. 2005 Dec 8;109(48):22836-42.

  • Novel silver nanostructures from silver mirror reaction on reactive substrates.
    J Phys Chem B Condens Matter Mater Surf Interfaces Biophys. 2005 Jul 28;109(29):13985-90.

  • Surface-enhanced Raman scattering of pyridine using different metals: differences and explanation based on the selective formation of alpha-pyridyl on metal surfaces.
    J Phys Chem B Condens Matter Mater Surf Interfaces Biophys. 2005 Feb 10;109(5):1788-93.

  • Production and characterization of stable superhydrophobic surfaces based on copper hydroxide nanoneedles mimicking the legs of water striders.
    J Phys Chem B Condens Matter Mater Surf Interfaces Biophys. 2006 Jun 15;110(23):11247-52.

  • Monte Carlo modelling of a simple accident dosemeter.
    Radiat Prot Dosimetry. 2005;116(1-4 Pt 2):486-8.

  • Surface enhanced Raman scattering based on silver dendrites substrate.
    J Colloid Interface Sci. 2006 Jun 15;298(2):765-8. Epub 2006 Feb 3.

  • Monte Carlo modelling of a simple accident dosemeter.
    Radiat Prot Dosimetry. 2005;115(1-4):276-8.

  • Justifying the need to prescribe limits for toxic metal contaminants in food-grade silver foils.
    Food Addit Contam. 2005 Dec;22(12):1219-23.

 

 

 

 

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